Foundry Business
First independent company in Japan specializing in foundry business
・Analog and Power semiconductor Pre-processing
・Backside Processing
・Epi Growth
・Chip-size Packaging
Our objective is not merely to engage in foundry business, but to contribute to the development of semiconductors in Japan by strengthening the fragile domestic supply chain of analog and power semiconductors, and by assisting domestic educational institutions in the research and development of such semiconductors.
Our Products
Technologies
|
Parts Processing
manufacturing process | Wafer size(mm) |
Epi(Sub/embedding) | 150 |
Thermal oxide film | 150 |
PE-CVD(SiO2/TEOS/SiN) | 150 |
LP-CVD(HTO/TEOS/Poly/SiN) | 150 |
CMP(SiO2/Poly/W) | 150 |
IGBTBackside Processing （TAIKO=>II=>480C lamp anneal=>Backmetal=>Probe=>Ring Cut =>Tape mount） | 150 |
Plating(electrolysis/electroless) | 150/200 |
Backgrind/TAIKO(Min60um)/Backmetal | 150/200 |
dicing | 150/200 |
TSV etching | 150/200 |
WLP | 200 |